MANUFACTURE OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor wafer with which process time and a raw material cost are reduced. SOLUTION: After a sliced semiconductor wafer 20 is treated in a diffusion process, the semiconductor wafer 20 is finished with a given thickness in a semiconductor wafer manufacturing step. The diffusion process is carried out for the front and rear faces of the wafer 20. The semiconductor wafer 20 is sliced at a position between the front and the rear faces into two pieces so as to obtain two semiconductor wafers with one of diffusion treated face and the other of non-diffused face. After that, the wafers are finished with a given thickness.