| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a semiconductor chip with a sealing material filled in the gap between the chip and a substrate with little bubbles left in the gap between the chip and the substrate. SOLUTION: A method comprises steps of feeding a liq. sealing material 14 to a part of a substrate 10 having electrodes 11 on the surface for mounting a semiconductor chip 12 having bumps 13 on the surface, putting it in a low pressure tank 20, laying the chip 12 on the part of the substrate 10 fed with the seal material 14 in the tank 20 held at a low pressure inside, connecting the electrodes 11 to the bumps 13, releasing the low pressure tank 20 from its internal atmosphere pressure while keeping the connected condition thereof to make bubbles 30 fine, and solidifying the seal material 14 while keeping the connected condition thereof. |
