| 摘要 |
<p>A method for providing a substantially electrically non-conductive substrate (11) with an electrolytically deposited metallic layer (14). The substrate (11) being associated with a member (12), such as a filament, having a relatively high electrical conductivity. The method comprising providing the substrate (11) and the member (12) with a coating (13) having a relatively low electrical conductivity and applying an electrical potential to the coating (13) to cause deposition of a metal on the coating (13) to form the metallic layer (14). The member (12) distributing the electrical potential throughout the member (12) to promote deposition of the metal across an area of the coating disposed over the substrate (11).</p> |
