Wafer-stage temperature compensation for IC components,申请号AU19960044106-传众专利搜索

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发明名称	Wafer-stage temperature compensation for IC components
摘要
申请公布号	AU706460(B2)	申请公布日期	1999.06.17
申请号	AU19960044106	申请日期	1995.11.07
申请人	THAT CORPORATION	发明人	GARY K HEBERT
分类号	H03F1/30;H03G3/10;(IPC1-7):H03F1/30	主分类号	H03F1/30
代理机构		代理人
主权项
地址

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