发明名称 |
Substrate for integrated circuit with first semiconductor substrate layer |
摘要 |
Substrate for integrated circuit has first semiconductor substrate layer formed of substrate monocrystal. On the first semiconductor substrate layer (10) is formed a second semiconductor layer (12) of a monocrystal with the same orientation as the first layer, and having a second doping concentration and the same conductivity as the first layer. On the first layer is directly formed a first semiconductor surface layer (11) from a monocrystal with the same orientation as the first layer. It has uniform third doping concentration and the same conductivity as the first layer for forming a first circuit section with numerous semiconductor elements. On the second layer is formed a second semiconductor surface layer (13), also of orientated monocrystal with fourth doping concentration and the second layer conductivity, to form a second circuit section with different function.
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申请公布号 |
DE19833951(A1) |
申请公布日期 |
1999.06.17 |
申请号 |
DE19981033951 |
申请日期 |
1998.07.28 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
KUNIKIYO, TATSUYA, TOKIO/TOKYO, JP;SONODA, KEN-ICHIRO, TOKIO/TOKYO, JP |
分类号 |
H01L27/08;H01L21/8242;H01L27/02;H01L27/04;H01L27/10;H01L27/108;(IPC1-7):H01L27/04;H01L21/76 |
主分类号 |
H01L27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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