Integrated electronic device comprising a mechanical stress protection structure

摘要

The integrated electronic device (1) comprises a protection structure (31) of metal, extending vertically and laterally to and along a predominant part of the periphery of an electronic component (3) integrated underneath the pad region (28). The protection structure (31) comprises a substantially annular region (21; 21b; 21c) formed from the second metal layer (20) and absorbing the stresses exerted on the pad during wire bonding. The annular region may be floating or form part of the path connecting the pad to the electronic component (3).