A lead frame for electronic semi-conductor devices
摘要
A lead frame (5) for electronic semi-conductor devices includes a continuous strip of material and a number of mounting surfaces (6) connected to the continuous strip by a connecting portion (7). Each connecting portion (7) defines an aperture (2) and each connecting portion (7) is attached to the respective mounting surface (6) by a single section of material (8). <IMAGE>
申请公布号
EP0923129(A1)
申请公布日期
1999.06.16
申请号
EP19970121865
申请日期
1997.12.11
申请人
SIEMENS AKTIENGESELLSCHAFT
发明人
WAN, SHARON KO MEI;KHIM, ALAN GAN CHIN;CHIN, TAN SIAN;RAHMAT, KARTINA JOHAN;SIAN, LIM WEI