| 发明名称 |
APPARATUS AND METHOD FOR POLISHING SEMICONDUCTOR DEVICES |
| 摘要 |
<p>The present invention provides a method and apparatus for conditioning a polishing pad in which slurry is directed under pressure at the polishing pad. Additionally, energy (i.e., ultrasonic energy) may be added to the slurry as it is directed towards the polishing pad, wherein embedded material in the polishing pad is removed or dislodged.</p> |
| 申请公布号 |
EP0921904(A1) |
申请公布日期 |
1999.06.16 |
| 申请号 |
EP19970931917 |
申请日期 |
1997.07.15 |
| 申请人 |
LSI LOGIC CORPORATION |
发明人 |
ALLMAN, DERRYL, D., J.;GREGORY, JOHN, W. |
| 分类号 |
B24B1/04;B24B53/007;B24B53/017;(IPC1-7):B24B37/04 |
主分类号 |
B24B1/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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