发明名称 Manually operated top loading socket for ball grid arrays
摘要 A socket for a ball grid array integrated circuit package (BGA) with an array of electrical contacts that extend through holes in a slidable plate. The arrangement of spacing the holes and the electrical contacts therein provides entry openings that allow the ball contacts of a BGA package to enter the openings. The contacts are cupped or angled to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is inserted into the socket without any interfering structure, and there may be guide surfaces to align the ball contacts with the openings. A manually rotatable cam actuated in one direction by an arm drives the plate parallel to the plane of the ball contacts to widen the openings to allow easy entry of the balls into the holes. Rotating the arm in the other directions drives the plate in the opposite direction reducing the openings. The arm is arranged at the side of the socket so as to not interfere with insertion or removal of the BGA itself. When the openings are reduced with a ball contact within the openings the balls are retained therein and electrical conductivity is provided between the ball contact and the socket electrical contact, and furthermore where the ends of the bifurcated contacts have sharp edges that penetrate any oxidation on the ball contacts to provide gas free connections. The bifurcated ends mates with the ball contacts near where the ball contacts attached to the BGA-package. This mating is above the equator of the ball and serves to retain the ball and so the BGA package itself in the socket.
申请公布号 AU1536599(A) 申请公布日期 1999.06.16
申请号 AU19990015365 申请日期 1998.11.25
申请人 PCD, INC. 发明人 MICHAEL J. RAMSEY
分类号 G01R1/04;H01L21/673 主分类号 G01R1/04
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