SEMICONDUCTOR DEVICE AND ASSEMBLY BOARD HAVING THROUGH-HOLES FILLED WITH FILLING CORE

摘要

A semiconductor device includes a board base having through-holes filled with a filling core , an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer , and nodes provided on a lower surface of the board base , wherein the one or more paths are laid out without a restriction posed by the through-holes , and are used for electrically connecting the semiconductor chip and the nodes.