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发明名称
BOTTOM LEAD PACKAGE FOR HEAT SINK
摘要
申请公布号
KR100202676(B1)
申请公布日期
1999.06.15
申请号
KR19960044489
申请日期
1996.10.08
申请人
HYUNDAI MICRO ELECTRONICS CO., LTD.
发明人
CHA, KI-BON
分类号
H01L23/367;(IPC1-7):H01L23/367
主分类号
H01L23/367
代理机构
代理人
主权项
地址
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