| 摘要 |
For a device (1) configured for surface mounting the IC (2), connecting pads (3), and the interconnecting leads (4) joined to the pads are all within the surface of the resin (6) with only the solder bumps (5) that are connected to the leads (4) showing through the surface of the mould. The resin encapsulation may also be used for devices configured for bump-grid array (BGA), zig=zag or ZIP, SVP or other PCB mounting methods, in each case only the appropriate device supports and connectors being accessible outside the resin mould for reflow soldering to the PCB surface. The method may also be used with TAB IC's. |
