| 摘要 |
PROBLEM TO BE SOLVED: To prevent the damage of a wafer during the sorting process by reading the position and attitude of the wafer extracted by the hand of a wafer conveying robot with a reading means at a first reading position, reading the written characters of the wafer with a reading means at a second reading position, and controlling the wafer conveying robot. SOLUTION: A wafer conveying robot 2 positions a wafer 1 in a feed cassette 3 at a first reading position below a first camera 9a. The correction data in the X, Y,θdirections based on the position coordinated of the wafer 1 are outputted to the wafer conveying robot 2 via the first camera 9a, a first image processing device 12a, a coordinated converting device 14 and a position correcting device 15. The wafer conveying robot 2 conveys and positions the wafer 1 so that the character description position of the wafer 1 enters the visual field of a second camera 9b at a second reading position. The wafer 1 is sorted by the second camera 9b, a second image processing device 12b and a sort data reference device 16, and the sorted signal is sent to the wafer conveying robot 2, and the wafer 1 is inserted into the prescribed sort cassette. |
