| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition having excellent storage property at a high temperature and excellent resistance to cracking induced by soldering and useful for sealing a semiconductor by using a crystalline epoxy resin, a specific phenolic resin hardener and a zeolite having a specific structure. SOLUTION: This epoxy resin composition comprises (A) a crystalline epoxy resin having 50-150 deg.C melting point, (B) a phenolic resin hardener containing >=50 wt.% of a phenolic resin (e.g. biphenyl type) selected from formulae I and II R1 is formula III or IV; R2 is formula III, (m) is 1-10}, (C) a hardening accelerator (e.g. triphenylphosphine, (D) an inorganic filler (preferably a spherical silica powder having extremely true sphere shape and a broad granular size distribution) in an amount of 75-92 wt.% based on the weight of the whole composition and (E) a compound of the formula: XM2/n O.Al2 O3 .YSiO2 .ZH2 O X=0.1-2; Y=1-200; Z=0-100; M is an alkaline (earth) metal; (n) is atomic valence} as essential components. Preferably, a maximum granular diameter of the component E is 150μm and an average granular diameter of the same is 5-30μm.
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