| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive-coated copper foil which facilitates the formation of an insulation layer on the surface of a metallic core and hole filling in the production of a metallic-core-containing printed wiring board by forming a layer of an adhesive resin containing an inorganic filler selected among alumina, silica, etc., on the roughened surface of a copper foil. SOLUTION: A layer of an adhesive resin (e.g. a resin prepared by mixing a tetrabromobisphenol A epoxy resin with a curing agent being dicyandiamide and a cure accelerator being 2-ethyl-4-methylimidazole) containing at least one inorganic filler having a particle diameter of, desirably, 10-100μm and selected among alumina, silica, mica, a glass powder, barium sulfate, and talc is formed on the roughened surface of a copper foil having a thickness, of for example, 7-50μm. It is desirable that the layer of the adhesive layer has a two-layer structure composed of a layer mode of an adhesive resin free from the inorganic filler and, desirably, closely adhering to the roughened surface of a copper foil and a layer of an adhesive resin containing the inorganic filler and desirably formed on the external surface of the former layer.
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