| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a transferring device and method for electroconductive balls which can flatten the electroconductive balls with a simple mechanism at the time of transferring to a work, and prevent occurrence of placing mistake. SOLUTION: In a transferring device for an electroconductive ball 7 of a ball supply part, the ball 7 is vacuum-attracted by an attraction head 31 for transferring to a work. In such a device, the attraction head 31 is horizontally moved and the electroconductive ball 7 attracted on its lower surface is pressurized against a roller 42 during the horizontal transferring passage, lower end height position of the electroconductive ball 7 is corrected. The number of the electroconductive balls 7 which are pressurized at the same time is thus limited, so that the lower surfaces of the balls 7 can be flattened with a small load. It is thus possible to suppress variation of height positions of the balls 7, and prevent occurrence of placing mistake at the time of transferring.</p> |
