METHOD FOR APPLYING A WAFER TO A MOUNT PLATE

摘要

A method for applying a semiconductor wafer (2) to a mount plate (5) of a polishing machine to polish the surface of the wafer (2) smooth. A wafer (2) of which the under surface is provided with an adhesive (10) is held by suction by a vacuum chuck (3). Then, a lower end of a hood (4) surrounding the wafer is made to abut on the mount plate (5) to define a sealed space section (6) around the wafer (2). The space section (6) is evacuated at a degree of vacuum higher than a degree of vacuum of the vacuum chuck (3). The wafer (2) drops from the vacuum chuck (3) when the degree of vacuum of the space section (6) exceeds the degree of vacuum of the vacuum chuck (3), and is adheredto the mount plate (5). By this construction, the wafer (2) can be applied to the mount plate (5) without the occlusion of air bubbles between the wafer (2) and the mount plate (5).