发明名称 |
Die attach adhesive compositions |
摘要 |
A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium.
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申请公布号 |
US5912282(A) |
申请公布日期 |
1999.06.15 |
申请号 |
US19960767057 |
申请日期 |
1996.12.16 |
申请人 |
SHELL OIL COMPANY |
发明人 |
IYER, SHRIDHAR R.;WONG, PUI KWAN |
分类号 |
C08G67/02;C09J9/02;H01L21/52;H01L21/58;H01L21/60;H01L23/495;(IPC1-7):C09J4/00 |
主分类号 |
C08G67/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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