PICKUP APPARTUS OF DIE BONDING DEVICE,申请号KR19960041778U-传众专利搜索

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发明名称	PICKUP APPARTUS OF DIE BONDING DEVICE
摘要
申请公布号	KR200148649(Y1)	申请公布日期	1999.06.15
申请号	KR19960041778U	申请日期	1996.11.25
申请人	HYUNDAI MICRO ELECTRONICS CO., LTD.	发明人	JEONG, SAM-KYUN
分类号	H01L23/48	主分类号	H01L23/48
代理机构		代理人
主权项
地址

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