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发明名称
HEAT SINK STRUCTURE OF PACKAGE
摘要
申请公布号
KR200143985(Y1)
申请公布日期
1999.06.15
申请号
KR19960028250U
申请日期
1996.09.05
申请人
HYUNDAI MICRO ELECTRONICS CO.,LTD.
发明人
HUR, JIN-GOO
分类号
H01L23/34
主分类号
H01L23/34
代理机构
代理人
主权项
地址
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