LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board for mounting of an electronic part, which has a holed internal wiring chip array structure and can greatly relieve or suppress a wire sweeping phenomenon when resin-molded to a semiconductor package. SOLUTION: Internal wiring chips are arranged so that a distance from the internal wiring chips positioned at corners perpendicular to a melt-resin injecting direction to a center of a semiconductor chip mounting area 2 is shorter than a distance from the internal wiring chips positioned at the resin injection side corner and at the corner opposed thereto and the center of the semiconductor chip mounting area, when molded for manufacture of a semiconductor package. Thereby in wire bonding for electrical connection between a semiconductor chip 6 mounted in the semiconductor chip mounting area 2 and the internal wiring chips, a length of wires positioned in a direction perpendicular to the resin flow-in direction becomes smaller than a length of wires positioned in a direction matched with the resin flow-in direction.