| 摘要 |
PROBLEM TO BE SOLVED: To improve binder removing properties and sinterability and to better adhesivity to an electrode, reduction in resistance of conductor wiring and dielectric characteristics in a produced electronic part, by laying a ceramic green sheet for a substrate between ceramic sheets not to be sintered at the sintering temperature of the sheet, laminating the sheets, integrally baking and removing unsintered ceramic powder. SOLUTION: A green sheet for a substrate comprising ceramic powder and/or glass powder and an organic binder is formed and an electrode or its precursor is made on the interior and/or the surface of the sheet. Green sheets for dummy comprising ceramic powder not to be sintered at the substrate sintering temperature of the green sheet for a substrate, oxide powder composed of an oxidizing agent and an organic binder are laminated to one side or both the sides of the green sheet and heat-treated in a nonoxidizing atmosphere to evaporate the organic binder. Then, the laminate is baked at the substrate sintering temperature and the unsintered ceramic powder constituting the green sheet for dummy is removed. |
