PROCEDE DE MESURE DE LA TEMPERATURE SUR DES COMPOSANTS EN FONCTIONNEMENT ET DISPOSITIF DE MESURE

摘要

The invention concerns a method for local thermal measurement at the surface of electronic components, which consists in coating the component with a sensitized layer whereof the Raman spectrum evolution is analysed on the basis of temperature. The sensitized layer-component assembly is irradiated with a focused beam, emitting in short wavelengths, characteristically the visible wavelength. The advantage of said method lies in the wavelengths used which enable to carry out very localised measurements. The invention is applicable to power components.