| 发明名称 |
High frequency chip mounting construction |
| 摘要 |
The chip can be held in position in the upper surround earthed sides and precision mounted onto the printed circuit below. The side walls of the carrier also form a chip cap section and screening. |
| 申请公布号 |
FR2771889(A1) |
申请公布日期 |
1999.06.04 |
| 申请号 |
FR19970015008 |
申请日期 |
1997.11.28 |
| 申请人 |
THOMSON CSF |
发明人 |
DADEN JEAN YVES;GOHN DEVINEAU MURIEL;CACHIER GERARD;ETOURNEAU PASCAL;JAHIER VINCENT |
| 分类号 |
H01L23/66;H05K1/02;H05K3/34 |
主分类号 |
H01L23/66 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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