REINFORCED SOLDER JOINTS FOR PRINTED CIRCUIT BOARDS

摘要

There is disclosed herein a printed circuit board 50 having reinforced solder joints, comprising: a substrate 11 having mounting pads 14 arranged thereon; a surface mount component 13 having terminations 12, wherein the component 13 is disposed on the substrate 11 with each termination 12 being registered atop a respective mounting pad 14; a solder joint 10 connecting each termination 12 with its respective mounting pad 14; and a thin metallic member 30 disposed within each solder joint 10 between each termination 12 and its respective mounting pad 14. A method for producing such reinforced solder joints is also disclosed.