SEMICONDUCTOR ELEMENT WITH DEFINED PERFORMANCE CHARACTERISTICS IN THE CASE OF FAILURE AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a semiconductor component comprising a semiconductor substrate (1) with one or several contact areas and one or several external connections (3). The contact areas of the semiconductor substrate (1) are joined to the respective external connections by means of at least one contact wire (11, 13, 14). The semiconductor component is cast in a moulded material (4) and is characterised in that at least one of the contact wires (11, 13, 14) is bared on one surface (5) of the moulded material (4) and dimensioned in such a way that it melts at a given current intensity. The design of said surface (5) is such that the contact wire (11, 13, 14) when melted is drained away. According to the method for producing the inventive semiconductor element, the contact wire (11, 13, 14) is embodied in such a way that it protrudes above the surface (5) of the semiconductor component when the external connection is joined to the semiconductor substrate (1) and presses against the moulding tool when the semiconductor component is cast .