STRUCTURED PRINTED CIRCUIT BOARDS, FOIL PRINTED CIRCUIT BOARDS AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a method for producing multilayered printed circuit boards and/or foil printed circuit boards and for producing semi-finished products for printed circuit boards and foil printed circuit boards using prefabricated items, comprising at least one insulator layer (2) or first structure (2*) and one or several conductor layers (1, 1') and a second structure (1*). Current path structures and through-plating structures are introduced into the conductor layers (1, 1') in a photochemical stage of said method, whereby the separating layers (6, 6') can be etched and/or removed by laser but cannot be plated. Through-plated openings (10) can be etched according to masking film through-plating structures (8, 8') in at least one insulating layer (2) or through-plated openings (10) can be made using laser removal in at least one insulating layer (2) or in a first structure (2*) whereupon said openings are subsequently plated.