发明名称 WAFER POLISHING MACHINE
摘要 <p>A polisher (10) comprises a turn table (12) having first and second end surfaces which are substantially normal to an axis of the turn table (12). The first end surface defines a polishing surface (16) for polishing an article (W). A drive shaft (20) is connected to the turn table (12) in such a manner that the shaft (20) extends along the axis of the turn table (12) from the second end surface of the turn table (12). The polisher (10) further includes a cooling system (60) which comprises a cooling fluid path (68) provided in the turn table (12) for passing a cooling fluid therethrough to deprive the polishing surface (16) of heat generated in a polishing operation and a fluid coupler (70) provided at the center of the first end surface of the turn table (12) for fluidly connecting the cooling fluid path (68) with a cooling fluid supply outside of the turn table (12).</p>
申请公布号 WO1999026760(A1) 申请公布日期 1999.06.03
申请号 JP1998005244 申请日期 1998.11.20
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