| 摘要 |
<p>A method and apparatus for through plating printed circuit boards. The method involves applying a liquid, particularly a curable polymer, including a conductive material to a board having a hole or holes drilled therethrough. Excess liquid is then removed from the board to leave a liquid coating on the inside surfaces of the hole(s). The liquid coating is then dried and, optionally, cured to leave an electrically conductive coating on the inside surface of the holes to provide an electrically conductive path from one side of the board to the other. The apparatus is arranged to carry out the method. Boards travel on a conveyor (20) under a liquid spray (22), excess liquid is then removed by squeegees (24) and air knives (26). The boards then pass through under heated air knives (26), to dry the liquid, under a rotating brush (27), which removes excess dried material, and into an oven (28) to cure the liquid.</p> |
