| 摘要 |
<p>A low-pressure processor (40) for processing substrates includes a chuck that engages the substrates' peripheries for purposes of clamping, sealing, and centering the substrates on chuck bodies. For accomplishing all three purposes, a mechanical clamp (60) can be arranged with two sealing regions (64, 66). One of the sealing regions seals the clamp (60) to a chuck body (44) or an extension of the chuck body, and another of the sealing regions engages a peripheral edge surface (56) of a substrate (50) for sealing the clamp (60) to the substrate. The peripheral engagement of the substrate exposes substantially the entire front surface (52) of the substrate to processing and exposes substantially the entire back surface (54) of the substrate to a heat-transfer gas for enhancing thermal transfers between the substrate and the temperature-regulated chuck body.</p> |
