| 摘要 |
PROBLEM TO BE SOLVED: To produce a high quality product by dicing a thin semiconductor wafer pasted to an adhesive sheet into unit semiconductor elements, peeling off the group of semiconductor elements at high speed from the adhesive sheet without damaging or cutting each semiconductor element, and then mounting each semiconductor element on a mounting board. SOLUTION: A system for dicing a semiconductor wafer pasted to an adhesive sheet into unit semiconductor elements comprises a separating means 100 for peeling off the group of semiconductor elements from the adhesive sheet, a means 200 for transferring each semiconductor element in the group to the mounting position, and a means 300 for mounting the semiconductor element on a board, while positioning relatively the electrodes formed on the semiconductor element and the electrodes formed on the mounting board. |
