| 摘要 |
PROBLEM TO BE SOLVED: To enable formation of reliable fillets between a semiconductor element and a mounting substrate by connecting the element and the substrate with underfills provided therebetween, to completely fill a gap between the substrate and the element, and to also improve the throughput by eliminating such steps as additionally providing the underfills. SOLUTION: A substrate 1 is a substrate for mounting a semiconductor element 31 having bumps 32 thereon. Provided on a semiconductor mounting surface of the substrate 1 is a film which is formed therein with grooves 21 along at least part of an outer periphery of the element 31 to be mounted on substrate pads 11 of the substrate 1. For example, a solder resist film 12 having the grooves 21 formed therein is provided on the mounting surface of the substrate. |
