| 摘要 |
An integrated circuit is protected from reverse engineering by connecting doped circuit elements of like conductivity (2S, 4S; 2D, 4D; 10D, 12S) with a doped implant (20, 22, 24) in the substrate (38), rather than with metallized interconnect. <IMAGE> <IMAGE> |
| 申请人 |
HUGHES ELECTRONICS CORP., EL SEGUNDO, CALIF., US |
发明人 |
BAUKUS, JAMES P., WESTLAKE VILLAGE, CA 91361, US;CLARK, WILLIAM M., JR., THOUSAND OAKS, CA 91360, US;CHOW, LAP-WAI, MONTEREY, CA 91754, US;KRAMER, ALLAN R., SIMI VALLEY, CA 93065, US |
