| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste which can form a thin adhesive layer, while exhibiting excellent thermal conductivity after adhesion/curing (low thermal resistance), and to provide a thin-film electronic device which is superior in heat dissipation. SOLUTION: A conductive paste containing conductive particles, a curable resin and a solvent is admixed with fine spherical conductive particles of Ag, or the like, having particle size in the order of 0.05-1 μm. The conductive paste thus produced is employed for mounting an electronic device, e.g. a semiconductor chip, in the manufacture of a semiconductor package. |
