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发明名称
Verfahren zum Bedecken oder Füllen einer Reliefstruktur durch Abscheidung aus der Gasphase und Verwendung dieses Verfahrens für die Herstellung von Halbleiterbauelementen
摘要
申请公布号
DE69509286(D1)
申请公布日期
1999.06.02
申请号
DE1995609286
申请日期
1995.02.24
申请人
FRANCE TELECOM, PARIS, FR
发明人
BENSAHEL, DANIEL, F-38000 GRENOBLE, FR;HALIMAOUI, AOMAR, F-38000 GRENOBLE, FR;BADOZ, PIERRE-ANTOINE, F-38000 GRENOBLE, FR;CAMPIDELLI, YVES, F-38000 GRENOBLE, FR
分类号
H01L31/028;H01L31/0352;H01L31/18;H01L33/00;H01L33/34;(IPC1-7):H01L33/00;H01L31/035
主分类号
H01L31/028
代理机构
代理人
主权项
地址
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