发明名称 PROCESSING METHOD AND PROCESSOR
摘要 <p>PROBLEM TO BE SOLVED: To form a liquid layer of treatment liquid having a thickness required for processing, to the surface even if the periphery of a board bends. SOLUTION: An LCD substrate G is held horizontally by a spin chuck 30, and the surface of the LCD substrate G held horizontally is supplied with developer from a developer supply nozzle 32. A developer holding means 35 is arranged in the position not in contact with the surface of the LCD substrate and besides in contact with the developer supplied to the surface of the LCD substrate G, in the periphery, at least, of the surface of the LCD substrate G. A liquid layer 55 of the developer is held between the developer holding means 35 and the LCD substrate G, on the LCD substrate G.</p>
申请公布号 JPH11150064(A) 申请公布日期 1999.06.02
申请号 JP19970332289 申请日期 1997.11.18
申请人 TOKYO ELECTRON LTD 发明人 TAKAMORI HIDEYUKI
分类号 G03F7/30;H01L21/027;H01L21/68;H01L21/683;(IPC1-7):H01L21/027 主分类号 G03F7/30
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