| 摘要 |
<p>PROBLEM TO BE SOLVED: To significantly reduce stress for eliminating occurrence of slip failure, etc., by supporting a semiconductor wafer by a supporting pin comprising a spring mechanism. SOLUTION: A semiconductor wafer holding device chiefly comprises a suscepter 2 placed in a chamber and a quartz plate 4 provided coaxially on a lower surface of the suscepter 2. A plurality of supporting pins 5 are made to protrude on the upper surface of the quartz plate 4. Related to array of the supporting pins 5, four are allocated at every 90 deg. on the same circumference on the surface of the suscepter 2 so that a semiconductor wafer W is supported on four-azimuth of wafer's rear surface. When the semiconductor wafer W is placed on these supporting pins 5, a marking such as orientation notch N, etc., provided at a position corresponding to, normally, <110> orientation is utilized. The supporting pin 5 is formed on such quartz plate 4 as a material with slight flexibility.</p> |
