| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a liquid which contributing to cutting from infiltrating into a cutting equipment, in the cutting equipment which cuts an object to be worked such as a semiconductor wafer, held by a rotatable chuck table, while liquids contributing to cutting such as cutting water and cleaning water are supplied. SOLUTION: This chuck table sealing mechanism consists of the following: a chuck table main body 38 which protrudes from a water cover 39 installed for preventing a liquid which contributes to cutting from permeating into an equipment, and on which a chuck table 31 is mounted, a recessed type seal ring 51 which is engaged with the outer periphery of the chuck table main body 38 and prevents the infiltration of the liquid, a protruding type seal ring 56 which is arranged on a water cover 39 in the non-contact manner inside the recessed type seal ring 51, and prevents permeation of the liquid, and a seal rubber 53 which laps inside the recessed type seal ring 51 and completely prevents the permeation of the liquid which contributes to cutting. The lapping part of the seal rubber 53 which laps the recessed type seal ring 51 is prevented from being exposed to a position, where the liquid is scattered, thereby preventing the liquid from infiltrating into the equipment.</p> |
