| 摘要 |
The package includes metallised holes (13) in insulating board (2) which is covered by conducting layers on both surfaces. The layers are etched to form conducting tracks (14, 15) and contacts (4, 6). Insulating layers (18, 19) of a photosensitive resin are formed on both surfaces of the board outside the region occupied by the contacts. The chip is stuck to the board by a thermally conducting glue (20), lying under the chip and filling the holes. The chip terminals are connected by a conducting wire (5) to the upper contacts (4) and encapsulated in an epoxy-resin (21). Connecting balls (17) are mounted on the lower contacts (6) for melting after mounting the board on an electronic card. <IMAGE> |
