| 摘要 |
PROBLEM TO BE SOLVED: To decrease the occurrence of cracks in a resin package and to form a highly reliable device by using a lead frame, wherein a notch or a through- hole is formed around a die pad and performing resin encapsulation. SOLUTION: After a die pad 21 of a lead frame is made lower than a lead 22 by one step, a semiconductor chip 11 is connected to the die pad 21 via Ag paste 14. A bonding pad and inner lead of the lead 22 are die-bonded with a gold wire 2. Packaging is performed through resin 13. Furthermore, as the bonding material for bonding a semiconductor chip 11 to the die pad 21, Ag paste 14 containing epoxy resin, which is a thermosetting resin is listed. However, the bonding may also be performed by other methods such as soldering or Au-Si eutectic method. Therefore, the peeling at the interface of the die pad and the resin is decreased, the cracks generated at the sealing resin is decreased and reliability can be improved. |
