发明名称 TREATMENT APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a treatment apparatus enhancing the quality and yield of a semiconductor. SOLUTION: A treatment apparatus 60 for applying a treatment soln. R to an object W to be treated through a pipe 64 has a treatment soln. supply part 61 storing the treatment soln. R to be applied to the object W to be treated, the nozzle 65 connected to the treatment soln. supply part 61 through the pipe 64 and dripping the treatment soln. R flowing from the treatment soln. supply part 61 to apply the same to the object W to be treated and the dust removing means 63 arranged to the pipe 64 between the treatment soln. supply part 61 and the nozzle 65 and having a filter part provided so as to come into contact with the treatment soln. positively charged to flow from the treatment soln. supply part 61.
申请公布号 JPH11147068(A) 申请公布日期 1999.06.02
申请号 JP19980001156 申请日期 1998.01.06
申请人 SONY CORP 发明人 KAMIYA MASAYUKI;IKEDA RIKIO
分类号 G03F7/16;B05C11/08;B05C11/10;G03F7/30;H01L21/027;H01L21/31;(IPC1-7):B05C11/10 主分类号 G03F7/16
代理机构 代理人
主权项
地址