发明名称 |
TREATMENT APPARATUS AND METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a treatment apparatus enhancing the quality and yield of a semiconductor. SOLUTION: A treatment apparatus 60 for applying a treatment soln. R to an object W to be treated through a pipe 64 has a treatment soln. supply part 61 storing the treatment soln. R to be applied to the object W to be treated, the nozzle 65 connected to the treatment soln. supply part 61 through the pipe 64 and dripping the treatment soln. R flowing from the treatment soln. supply part 61 to apply the same to the object W to be treated and the dust removing means 63 arranged to the pipe 64 between the treatment soln. supply part 61 and the nozzle 65 and having a filter part provided so as to come into contact with the treatment soln. positively charged to flow from the treatment soln. supply part 61. |
申请公布号 |
JPH11147068(A) |
申请公布日期 |
1999.06.02 |
申请号 |
JP19980001156 |
申请日期 |
1998.01.06 |
申请人 |
SONY CORP |
发明人 |
KAMIYA MASAYUKI;IKEDA RIKIO |
分类号 |
G03F7/16;B05C11/08;B05C11/10;G03F7/30;H01L21/027;H01L21/31;(IPC1-7):B05C11/10 |
主分类号 |
G03F7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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