| 摘要 |
PROBLEM TO BE SOLVED: To obtain a ceramic board which is enhanced in repair resistance and connection strength by a method wherein a continuous P-condensed layer is restrained from being formed after Sn-Ag soldering is carried out when a ceramic wiring board is subjected to electroless Ni-Au plating. SOLUTION: An Ni-B plating film is formed on the W sintered conductor of a ceramic wiring board and then roughened by an acid treatment. Then, a P-containing Ni plating film 4 is formed as thick as 0.3 to 0.7μm, and then an Au-substituted plating film 5 is formed as thick as 0.1 to 0.2μm. Thereafter, a part such as an LSI is connected with an Sn-3Ag solder ball 6. A ceramic wiring board is enhanced in repair resistance and connection strength, and an electroless Ni/Au plating film capable of ensuring a part such as an LSI of connection reliability can be obtained.
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