| 摘要 |
PROBLEM TO BE SOLVED: To easily provide optimum electromagnetic connection regardless of the type and the RF characteristic of a semiconductor chip by providing a joint part for the electromagnetic connection of the input/output electrode of the semiconductor chip and the I/O lead of a package, and providing a structure which is capable of adjusting a distance between an input/output electrode and an I/O lead. SOLUTION: An I/O lead 15 is provided for a package 11 and an RF pad 14 is provided for the semiconductor chip 13, and they are at almost same in height. Input/output electrode 16a and a ground electrode 16b are formed in the joint part 16 for electromagnetic connection. A supporting part 17 is fitted to the package 11 by an adjustment screw 18, and a spring 19 is provided between the supporting part 17 and the package 11. Thus, the adjusting spring is manipulated, the supporting part 17 and the joint part 16 can be made to move vertically and a clearance A can be most suitably adjusted. Then, the package 11 and the joint part 16 is set to be common, even in the case of mounting a semiconductor chip 13 of different RF characteristic/form. |
