| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder used for mounting from flowing into between a package bottom surface and a substrate to cause a short circuit between leads, by providing such steps as to form a space to a lead, on the side of the package mounting surface of a package side surface. SOLUTION: A lead 6 is so provided on a side surface of a package 4 that an open end faces in the direction of package mounting surface side, with an optical element connected to an external circuit. Especially, a recess step 12 so provided as to form a space to the lead 6 is provided on a package mounting surface side of a package side surface. A semiconductor device is mounted on a substrate 8 via a through-hole 10 provided at the substrate 8 with a semiconductor element module. With soldering which is performed via the through- hole 10, the recessed step 12 is so formed that a bottom surface of the package 4 does not make contact with a conductor pattern provided around the through- hole and the solder used for mounting. |
