发明名称 HEATABLE FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heatable floor structure which 1) prevents the surface of a floor from getting too high above the ground work surface of the floor of a building, 2) eliminates an excessive increase in the material cost for the floor and 3) significantly simplifies construction work as compared with the conventional floor. SOLUTION: A subfloor plate is mounted on an underfloor ground surface being supported by a support leg 12 and joist pieces 15 are arranged on the top surface of the subfloor plate at a fixed interval. A floor heating panel 16 which has a flexible tube 19 for a heat medium imbedded into a groove cut into the top surface thereof is arranged between the joist pieces 15 adjacent to each other and a surface cover layer 17 is arranged on the top surfaces of the floor heating panel 16 and the joist pieces 15.
申请公布号 JPH11148656(A) 申请公布日期 1999.06.02
申请号 JP19970319279 申请日期 1997.11.20
申请人 MITSUBISHI KAGAKU SANSHI CORP;SANYO KOGYO KK 发明人 SASAKI TAKASHI;INOUE NORIAKI;TENMA YASUSHI;INAMOTO FUMIO;OGOSHI TADASHI;KONNO AKIHIKO
分类号 E04F15/18;F24D3/14;F24D3/16;(IPC1-7):F24D3/16 主分类号 E04F15/18
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