发明名称 |
HEATABLE FLOOR STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a heatable floor structure which 1) prevents the surface of a floor from getting too high above the ground work surface of the floor of a building, 2) eliminates an excessive increase in the material cost for the floor and 3) significantly simplifies construction work as compared with the conventional floor. SOLUTION: A subfloor plate is mounted on an underfloor ground surface being supported by a support leg 12 and joist pieces 15 are arranged on the top surface of the subfloor plate at a fixed interval. A floor heating panel 16 which has a flexible tube 19 for a heat medium imbedded into a groove cut into the top surface thereof is arranged between the joist pieces 15 adjacent to each other and a surface cover layer 17 is arranged on the top surfaces of the floor heating panel 16 and the joist pieces 15. |
申请公布号 |
JPH11148656(A) |
申请公布日期 |
1999.06.02 |
申请号 |
JP19970319279 |
申请日期 |
1997.11.20 |
申请人 |
MITSUBISHI KAGAKU SANSHI CORP;SANYO KOGYO KK |
发明人 |
SASAKI TAKASHI;INOUE NORIAKI;TENMA YASUSHI;INAMOTO FUMIO;OGOSHI TADASHI;KONNO AKIHIKO |
分类号 |
E04F15/18;F24D3/14;F24D3/16;(IPC1-7):F24D3/16 |
主分类号 |
E04F15/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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