OPTICAL SEMICONDUCTOR MODULE PACKAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a high-general purpose property packaging device of a structure, wherein an optical semiconductor module is mounted on a circuit board and the intrinsic characteristics of the module is ensured. SOLUTION: An optical semiconductor module 1 is obliquely inclined and is supported by an L clamp 3 fixed in a height adjusting hole and the position of a lead pin 6 of the module 1 is adjusted so that the lead pin 6 coincides with a signal input/output line of a high-frequency circuit board 4. The short lead pin 6 is fixed on the signal input/output line with solder. Moreover, the circuit board 4 is arranged also under the module 1.