发明名称 A method of manufacturing a peripherally encapsulated unit
摘要 A peripherally encapsulated unit is manufactured by molding a peripheral encapsulation (F) of a predetermined internal peripheral contour and internal peripheral size from hot polymeric material in a mold (10). The mold (10) is opened and a member (G) is positioned in internal relationship to the hot molded peripheral encapsulation (F). Thereafter, the hot molded peripheral encapsulation shrinks as it cools to reduce its internal peripheral size thereby unitizing the peripheral encapsulation (F) with a peripheral edge portion of the member (G) to form a peripherally encapsulated unit, such as a cook top, range door, "touch" control panel, or the like. <IMAGE>
申请公布号 EP0919361(A2) 申请公布日期 1999.06.02
申请号 EP19980122495 申请日期 1998.11.27
申请人 GEMTRON CORPORATION 发明人 BIRD, KEVIN;KAPER, LLOYD;HERRMANN, BOB;BIENICK, CRAIG;REAMES, GARY;DALEY, HOWARD;WOLTERS, GREG
分类号 B29C63/00;B29C65/66 主分类号 B29C63/00
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