| 摘要 |
A multi-layer film substrate comprising at least two laminated insulating layers composed of a polyimide having a low thermal expansion, wherein an adhesion layer composed of an Si-containing or SiO2-dispersed polyimide is interposed between the low thermal expansion polyimide layers. The substrate is produced by laminating at least two insulating layers composed of a polyimide having a low thermal expansion, wherein the low thermal expansion polyimide layers are laminated through an adhesion layer composed of an Si-containing or SiO2-dispersed polyimide.
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