Electronic device for testing bonding wire integrity

摘要

A device presenting pairs of split contact pad portions, each pair of pads having multiple bonding wire, and metal connecting strips associated therewith. The end portion of the metal connecting strips being split into parallel strip segments, each connected to a respective contact pad, so as to form a plurality of parallel current paths between a node and an external contact pin connected to the node. When current is supplied along the connecting strip a voltage drop along each segment connected to a sound bonding wire is produced, but not along the segments connected to broken or non-bonded wires. By determining the existence of a voltage difference between the contact pad portions, it is possible to detect the interruption of one or more of the bonding wires.