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发明名称
DIE BONDER
摘要
申请公布号
KR100189378(B1)
申请公布日期
1999.06.01
申请号
KR19960005342
申请日期
1996.02.29
申请人
ANAM SEMICONDUCTOR LTD.
发明人
SONG, CHI-JEONG
分类号
H01L21/60;(IPC1-7):H01L21/60
主分类号
H01L21/60
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代理人
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